On August 6, Sony’s noise-canceling headphone series finally had an update. Sony WH-1000XM4 was officially launched on the official website for pre-sale. So what’s the exact update inside of it? Let check out my Sony WH-1000XM4 First Teardown Review in the world.
Unboxing of Sony WH-1000XM4
The packaging box continues the style of the previous generation, with a white tone and black font. On the upper left corner of the front, there is the SONY LOGO, and there is a rendering of the left ear of the product on the right. On the lower left side, there are the mean feature LOGOs of it.
On the back, there is an operation guide with graphics and text, an APP download link on the device side, a number of product features, and various certification or identification information such as Hi-Res AUDIO, NFC, and LDAC.
On the side, there are the words “Famous Noise Reduction Technology” in the industry and the appearance rendering of the SONY HD Noise Cancelling Processor QN1 chip.
The packaging box has a drawer-like structure, and the top layer of the inner packaging has a easy setup guide for the product.
There are a storage box and manual in the box. The earphones and accessories come in the storage box.
Here is the appearance of the storage box at a glance. There is a mesh pocket on the front and portable ears on the side.
Sony WH-1000XM4 teardown
First remove the earmuffs, the left ear headset has an infrared distance sensor inside to detect the wearing status.
There is a distance sensor opening inside the mesh cloth of the left ear earmuff.
A close-up of the back of the left earmuff, and the outer leather is secured by a bayonet.
Here is the close-up of the distance sensor opening.
Under the earmuff is a piece of sponge.
Remove the sponge to expose the headphone unit.
Here is the speaker unit protective sponge close-up.
Above the unit is a noise-canceling microphone. The unit is recessed deeper, the integration of the headset has been further improved compared to the previous generation.
Right earphone teardown
The inside of the right earphone is fixed to the shell by black and white screws.
The structure on the left and right is basically the same, with an additional window for the distance sensor.
Here is the close-up of the distance sensor window.
The noise canceling microphone is fixed on the bracket by a gray-white soft rubber fixing card.
Here is the close-up of the speaker 40mm driver unit. It has aluminum-plated liquid crystal polymer (LCP) diaphragm.
Here is the close-up of the fixing part.
The noise canceling microphone uses electret microphone and shielded wire connection to effectively prevent electromagnetic interference from affecting the sound.
There is a dust-proof net on the front of the electret microphone.
The speaker unit of the earphone is placed obliquely at a certain angle with the plane of the backboard, which is more in line with the structure of the human auricle, so that the sound can be more effectively received by the ears.
Unscrew the screw and open the earphone shell. Inside the right shell is the touch panel, and the battery is inside the right earphone.
There are many sockets on this small board, which are used for touch control, noise canceling microphone, left and right earphone connection and battery power supply.
Unplug the battery plug.
Disconnect the cable and remove the touch panel.
Here is the staggering wiring on the back of the touch panel.
The noise canceling microphone has an opening and is covered by a foam pad.
There is a sealing rubber ring at the seam of the earphone shell to prevent water and dust.
Regular routing on the back of the touchpad is used to detect touch operations.
The thermistor with black foam is glued on the battery to detect the battery temperature.
The thermistor is connected to the small board through a cable.
Here is the front of the battery.
Here is the back of the battery.
Here is a close-up of the thermistor cable that detects the battery temperature.
Here is the thermistor close-up.
The battery is the same as the WH-1000XM3 battery, which is also made in MADE IN CHINA. There is a lithium-ion battery pack model: LIS1662HNPC, nominal voltage: 3.7V, rated capacity: 1100mAh, charging limit voltage: 4.2V, manufacturer: Sony, and warning information.
There is a label on the back of the battery, and there are precautions on the label to prohibit incineration, disassembly, short-circuit, and information such as model LIS1662HNPC and capacity 4.1Wh.
The battery comes from Murata. The battery size is 6.3X40X38mm, approximately square.
There are PTC resettable fuses and integrated battery protection IC on the protection board.
The battery is fixed by the frame inside the earphone.
There is a touch chip and a charging IC on the back of the C-type small board.
There are many cable sockets on the front, which is also a larger part of Sony’s internal upgrade. The application of snap-on cable sockets greatly reduces the labor cost.
TI Texas Instruments BQ27421 integrated sampling resistor power detection chip, used to detect battery power.
Here is a screen printing 02C IC.
Screen printing XD02Z IC.
Screen printing WZ74 IC.
A POSCAP capacitor is used for battery-side filtering.
Screen printing M02 IC.
Screen printing S3FZ IC.
Screen printing XDO IC.
Screen printing H30 IC.
Rohm BD11600N, double pole double throw switch, used to switch USB data.
MPS MP2625B charging IC, which charges the built-in battery of the headset and supports power path management.
Atmel ATSAMD21J17D microcontroller, used for touch detection.
The noise canceling microphone is fixed on the cavity with a rubber sleeve.
The pressure relief hole of the sound cavity is covered by a dust-proof net.
Remove the rubber sleeve and there is a dust-proof net on the front of the electret microphone.
Left earphone cavity
Remove all screws to open the sound cavity.
There is a rubber pad between the speaker and the cover to reduce the cavity resonance.
The speaker unit is surrounded by a layer of sponge for tuning.
After actual measurement, the speaker diameter is 40mm, which is what the official Sony annouced.
The close-up of Type-C input board.
A close-up of the internal structure of the Type-C charging interface and indicator light.
The close-up of indicator light guide.
There is an overvoltage and overcurrent protection IC on the back of the small board.
Type-C female seat has a through-hole welding.
A close-up of the LED indicator.
Screen printing 047A 0G79 overvoltage protection IC.
Left earphone teardown
Inside the left earphone is a noise-canceling microphone and NFC antenna.
The NFC antenna board is fixed on the cover plate, and the 3 microphones are respectively located on the cover plate wall. It is connected together through a flexible flat cable, then connected to the motherboard socket.
A close-up of the small NFC antenna board, the main board cable and the small board are connected by welding, and the solder joints are solid.
The IC of 90030 JAPAN IL02001 screen printing on the NFC module. The module comes from Japan.
The microphone unit is fixed on the inner wall of the cavity by a double way of buckle and glue.
The close-up of the laser carving K563J272 noise canceling microphone.
A close-up of the left earphone motherboard.
A list of components on the front of the motherboard, there is a Sony’s own noise canceling chip.
A list of components on the back of the motherboard, the largest one is MTK MediaTek’s Bluetooth chip.
Solder the pads of the microphone and speaker.
Bluetooth wave filter, patch welding.
Two 6V100μF tantalum capacitors.
Screen printing NGAN IC.
Screen printing 0LV IC.
The newly upgraded Sony CXD90050 HD noise canceling processor QN1 integrates a digital noise reduction processor, a 32bit audio signal processor, a digital-to-analog converter and an analog power amplifier to achieve an excellent sound quality with high signal-to-noise ratio and low distortion.
Q128JWYIQ Bluetooth chip external memory.
Screen printing FHU0DB15 IC.
Laser carving 344 KS air pressure sensor.
LATTICE ice40ul1k programmable gate array.
Cirrus Logic CS48L32 is a low-power smart audio codec chip that supports Always-on Voice. It supports low-power voice wake-up anytime and anywhere, ultrasonic proximity detection and pressure sensing. It can be also used as a button instead. Besides, it comes with an AI-powered DSP function.
Screen printing 9CR IC.
Screen printing 90DZ IC.
Screen printing 1X6 IC.
Screen printing 107 IC.
Tantalum capacitors with screen printing J8.
MEDIATEK MediaTek MT2811 platform solution is equipped with the MCSync TWS dual-transmit Bluetooth transmission mechanism. It supports seamless connection experience of master-slave exchange, Bluetooth 5.0, Ultra-low power and some other function.
It is said that MT2811 is a high-performance chip in Airoda AB155x platform series. The flagship products such as Sony’s WF-1000XM3 and Sony WI-1000XM2 before are also equipped with this series of chips.
Left earphone cavity
Open the left ear sound cavity, there is a 3.5mm audio input jack plate in the cavity.
The 3.5mm audio input jack board is fixed in the cavity by a screw.
The 3.5mm audio input jack is welded through-hole, and the main board cable is welded to the small board, and the solder joints are solid.
A close-up of the 3.5mm audio input jack.
The function key plate is fixed on the inner wall of the cavity by a bracket.
A close-up of the internal structure of the function buttons, the left side is the power button, and the right side is the custom function button.
Close-up of patch buttons and indicator lights.
Button patch welding.
Two LED indicators of different colors.
Infrared distance sensor small board.
The small board is fixed inside the cavity with double-sided tape and is connected by a flat cable.
Infrared distance sensor close-up.
Overall teardown close up of Sony-WH1000XM4.
SONY WH-1000XM4 continues the previous generation product in appearance design. The super solid internal workmanship also reflects Sony’s great control of product quality. The use of a large number of buckle socket connections can reduce manual participation in the production process.
In terms of hardware configuration, the main control uses the MediaTek MT2811 Bluetooth chip, which supports Bluetooth 5.0. The newly upgraded Sony CXD90050 HD noise canceling processor QN1 works with multiple microphones to provide a deeper noise canceling experience.
Thanks to a variety of chip upgrades, the power consumption of Sony WH-1000XM4 has been effectively controlled. The same 1100mAh battery as the previous generation can still maintain the 30h battery life in ANC mode. The minor hardware upgrade is mainly for the newly added software functions and services, which can definitely bring users a more complete experience of using noise-canceling headphones.